LCD Module  液晶顯示模塊

With efficient production processes and R&D capability, which allow us, providing high quality LCD modules to our customers.  According to display appearance, we can provide character types and graphic types modules.  Our character types of LCD modules ranging from 8x1 to 40x4, available in a variety of fluid modes, backlighting, temperature ranges and viewing angles.  For the graphic types of LCD modules, we can supply 48x32 dots matrix up to 320x240 dots matrix (i.e.1/4 VGA), available in different characteristics.

Apart from display types, we can classify LCD modules by mounting methods.  Po Sing supports assembly technologies of SMT, TAB, COB, COG & COF.  Each method has their advantages and related applications. 

SMT (Surface Mount Technology)

電子零件表面安裝技術

This is a traditional and very popular method of PCB mounting method.  This type of assembly is using IC chips directly attached in PCB.  Reliability of LCD modules formed by this method is very stable.  However, the drawback of this mounting is requiring quite large PCB area.

COB (Chip On Board)

芯片結成於印刷線路板技術

This mounting method utilizes wire-bonding of bare die attached on PCB surface directly.  LCD drivers or controllers are formed in PCB by gold wires, covered with epoxy.  Therefore, this technology allow compact design and the size of LCD modules can be reduced much.  When comparing with SMT, the cost of COB can be cheaper due to smaller size of PCB involved and parts involved.  Also, the cost of IC falling down is one of the reason too.  Most of our standard character type LCD modules are using this method.

TAB (Tape Automated Bonding)

芯片透過導電膠連接於印刷線路板技術

LCD drivers or controllers are soldering on thin, hard bubble package with ACF using heat & pressure fitting.  TCP IC chips and then sealed onto thin plastic substance.  This method can be applied to wide range of resolution level with fine pitches.  The area of LCD modules can be reduced by compactness because IC and its interfacing circuit can be bent at the back of the LCD panel.  However, this method has a weakness if the design involved indicator or keypad around the display, and the cost will become higher.  When comparing with COG, TAB is more expensive.  Besides, the bonding area of TAB is weaker than COG in general.   

COG (Chip On Glass)

芯片固定於玻璃表面技術

Bumped gold chips or IC chips attached to LCD with ACF using heat and pressure fitting.  LCD drivers or controllers are attached on LCD sue directly that allow COG has high reliability.  COG allows space saving because the thickness of its modules can be reduced to nearly 2mm.  Besides, due to the weakness of bonding area of TAB and therefore COG is more reliable than TAB.  This means always apply in very compact application design because it can reduce the mounting area and weight.  COG is more cost effective than COB but it is a good choice for graphic LCD modules.  

COF (Chip On Film)

芯片固定於軟性線路板技術

This is a high-tech and new developed mounting method.  Bumped gold chips or IC chips connected to PCB film.  This method can reduce the capacity of LCD modules greatly.  But, it is quite expensive than other mounting methods at this moment.

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